Top-side cooled power semiconductors are gaining interest across the power electronics design community. Improved thermal management, design flexibility and simplified assembly are among the benefits of designing with top-side cooled devices. In this Tech Chat, those benefits are applied to Wolfspeed’s portfolio of silicon carbide top-side cooled MOSFETs.
Related Content
3.3 kV SiC-Based Modular Reference Design
SiC reference design targeting high power applications such as cold-ironing for the reduction of emissions and form factor in shore-to-ship power systems.

Explore New Power Products & Design Resources from Richardson RFPD at PCIM 2025
From concept to production, discover at PCIM 2025 how Richardson RFPD can support your power conversion and energy storage system designs every step of the way.

2300 V Three-Phase Inverter from Wolfspeed
The 2300 V three-phase inverter reference design demonstrates the design simplicity and scalability of Wolfspeed’s new 2300 V baseplate-less SiC power modules.