Solutions for 5G Active Antennas and Small Cells

NXP enhances active antenna systems with the flexibility of GaN discrete solutions and the high integration of multi-chip modules.
NXP is powering the 5G Access Edge which includes the critical infrastructure equipment between the 5G core and the end-user.
NXP’s 5G Access Edge technologies, best on the open O-RAN architecture, let designers deploy tailored 5G solutions faster while giving them an easier, more cost-effective way to maintain, upgrade and extend their 5G capabilities.

NXP Solutions for Sub-6GHz 5G Active Antennas and Small Cells

NXP enhances active antenna systems with the flexibility of GaN discrete solutions and the high integration of multi-chip modules. Our full lineup solutions of multi-chip modules, GaN discrete products, LNAs and ICs support the evolution of 5G mMIMO active antenna system requirements for cellular base stations. Our innovative GaN, LDMOS and SiGe devices offer high levels of integration, increased output power, extended frequency coverage and improved efficiency ─ all in compact form factors.

NXP offers the widest available RF Power Amplifier product portfolio for wireless infrastructure that spans multiple levels of integration, including; discrete transistors, multistage IC’s, and multi-chip modules (MCM), as well as leveraging GaN and Silicon LDMOS from the latest cutting edge NXP fabs.

NXP’s Rx Modules are integrated multi-chip modules designed for TD-LTE and 5G mMIMO applications. Available in both single and dual channel configurations, the Rx Modules combine T/R switch, two-stage LNA, and support circuitry to work from a 5V supply and a 1.8 V logic-level T/R control.

NXP’s RapidRF front-end designs for 5G Infrastructure integrate a linear pre-driver, RF Power amplifier, Rx LNA with T/R switch, a circulator and bias controller and DPD feedback coupler in a compact footprint. RapidRF reference boards are ideal for radio units requiring 2.5-8W (34-39 dBm) average transmit power at the antenna. Versions for different bands use a common PCB layout, simplifying both design and manufacturing for faster time-to -market.

NXP has introduced a family of 5G massive MIMO modules utilizing its innovative new top-side cooling package technology. The first products are designed for 32T32R 200 W radios, covering 3.3 GHz to 3.8 GHz frequency bands and leveraging the latest proprietary GaN technology manufactured in NXP’s new fab in Chandler, AZ. Smaller, thinner, and lighter systems will enable significant cost savings, plus more environmentally friendly base stations, while achieving the full performance benefits of 5G.

NXP Solutions 5G Resources

Description
Wim Rouwet from NXP demonstrates a 5G small cell radio that provides an Open RAN development platform for a SDR-based radio unit showing the application of DPD to improve performance.

RF & Microwave Support

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About our Team of Experts

Richardson RFPD has a team of over 50 technical resources available to provide design assistance on a variety of topics.  Although there are too many to name, we have highlighted specific topics that provide a representation of our support.