NXP Power Amplifers
NXP LDMOS IC’s offer high performance and integration to speed your development. These Multi-Chip Modules (MCMs) are built on high performance LDMOS. LDMOS ICs simplify design implementation as they incorporate multiple gain stages, 50 ohm matching for input or input/output, and Doherty splitters and combiners. Covering 0.4 – 3.7 GHz with average power handling of 4-10W per device, LDMOS ICs are ideal for DAS/AAS, small cells, and repeaters.
NXP PA Modules were developed for OEMs to deploy 5G mMIMO equipment quickly. The first generation of LDMOS PAM’s included 50-Ohm impedance matching (I/O) and Doherty splitters and combiners. Later releases included integrated gate drivers (Smart LDMOS) and GaN. The NXP PA Modules are optimized for 5G Sub-6GHz mMIMO, small cells and repeaters from 2.3 – 4.2 GHz, with average power levels of 2.5-9 W.
MMIC amplifiers and integrated multi-chip modules can speed development time, but not every project can leverage one of these solutions. NXP offers a full line of discrete RF transistors and reference circuits to help tackle your next high-power project. Whether it is for mMIMO or Macro base station and Remote Radio Units, NXP Discrete Transistors can get you to market faster. NXP discrete transistors are offered in LDMOSFET and GaN on SiC HEMT technologies, covering 0.4 – 4.2 GHz with power levels spanning 2W average to more than 80W average.
NXP Product Features
With this launch, NXP’s discrete massive MIMO portfolio now covers all cellular frequency bands from 2.3 to 4.0 GHz, leveraging NXP’s latest proprietary GaN technology.
This 8 W symmetrical Doherty RF power GaN transistor is designed for cellular base station applications requiring very wide instantaneous bandwidth capability.
NXP 5G Resources
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NXP’s Rx Modules are integrated multi-chip modules designed for TD-LTE and 5G mMIMO applications.
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RapidRF reference boards are ideal for radio units requiring 2.5-8W (34-39 dBm) average transmit power at the antenna.
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NXP has introduced a family of 5G massive MIMO modules utilizing its innovative new top-side cooling package technology.